By combining X-ray, AI and spectral imaging, TDF is developing a non-destructive characterization process for rich waste, such as electronic cards, in order to boost the entire recycling industry by providing collectors with knowledge of the true value of their waste.
Value chain disruption
Machines connected to OSIRX NETWORK
The only machine in the world designed to give the true value of waste
Relative error of quantification of metals less than 1%.
Ad hoc camera developed in-house from scratch using a CERN chip
Mesh devices to map WEEE flows
Easy to use HMI, developed for the operator’s comfort
REAL TIME PRICES
Real time prices of deposits via connection to the LME
Quantification AI progressing as the analysis proceeds
According to numerous options available